发明名称 LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
摘要 A light-emitting chip (22) includes: a container (30) having a concave portion (31); first to fourth lead portions (61) to (64), provided to be exposed to the concave portion (31); and a first blue LED to a fourth blue LED (74) mounted on the first to fourth lead portions (61) to (64) exposed to the concave portion (31). The container (30) includes a first container portion (40) covering the region of the concave portion (31) where the first to fourth lead portions (61) to (64) are not exposed, and a second container portion (50) contacting the first to fourth lead portions (61) to (64) without being exposed to the concave portion (31) and accommodating the first container portion (40). The first container portion (40) is formed of a material having higher light reflectivity than that of the second container portion (50), and the second container portion (50) is formed of a material having higher thermal conductivity than that of the first container portion (40). Thus, a decrease in extraction efficiency for light emitted from a light-emitting element can be suppressed, and a rise in the temperature of the light-emitting element in response to the light emission can be suppressed.
申请公布号 US2011255281(A1) 申请公布日期 2011.10.20
申请号 US200913142171 申请日期 2009.12.16
申请人 SHOWA DENKO K.K. 发明人 TAKEI TOMOYUKI;MIKI HISAYUKI
分类号 F21V7/00;H01L33/60 主分类号 F21V7/00
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