| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing agent for epoxy resin to produce a resin cured material which is excellent in high heat resistance and a low linear expansion property.SOLUTION: The curing agent for epoxy resin is represented by general formula (I) and includes a bisimide phenol compound (a) having a solubility of 0.5 wt.% or more to a ketone solvent at 60°C. Rrepresents a univalent functional group excluding a hydroxy group or a hydrogen atom. R-Reach represent a hydrogen atom, hydroxy group or a 1-10C organic group and are capable of forming a ring having ≤20C which condenses to benzene ring by binding two adjacent groups. At least one among R-Rhas a hydroxy group. Rrepresents a specific organic group. X represents a single bond such as -SO-, -O-, -CO-, -C(CF)-, -S-, or a bivalent 1-20C organic group and n is 0-3. |
