| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing costs by packaging a light-emitting element and a circuit element at a time.SOLUTION: In a light-emitting device, bending units 20d, 21d are provided in arm pieces 20b, 21b for supporting a light-emitting element packaging unit, thus changing a posture of the light-emitting element 3 by packaging the light-emitting element 3 to a light-emitting element packaging unit and then by bending the bending units 20d, 21d. Therefore, the light-emitting element 3 and the circuit element are packaged at a time without any need for changing a posture of a conductive material 2 (support 1) in packaging of the light-emitting element 3, and in packaging of the circuit element as conventionally, thus reducing manufacturing costs as compared with a prior example. |
