| 摘要 |
PROBLEM TO BE SOLVED: To provide an expand device that increases chip intervals for wafers having a plurality of kinds of plane shape.SOLUTION: This invention relates to the expand device 10, wherein a workpiece W1 is a semiconductor wafer W including a plurality of chips C united through an adhesive sheet S on an inner peripheral side of a ring frame RF, and the expand device 10 includes a support means 12 of supporting the workpiece W1, a contact means 13 having a contact portion 35A capable of abutting on a reverse surface side of the adhesive sheet S, and a driving means 14 of elevating the support means 12. A plurality of contact means 13 are provided and selectively used, and configured such that contact portions 35A of the respective contact means 13 have different plane shapes. The adhesive sheet S is applied with tensile force in a radiation direction by lowering the support means 12 down to below an upper end of the contact member 13 to widen the chip C intervals. |
