LIQUID EJECTING HEAD, LIQUID EJECTING HEAD UNIT, LIQUID EJECTOR, AND METHOD OF MANUFACTURING LIQUID EJECTING HEAD

摘要

PROBLEM TO BE SOLVED: To provide a liquid ejecting head which surely seals a circuit substrate and reduces the displacement of the bonding position of split holding members and bonds displacement of a flow path, and to provide a liquid ejector and a method of manufacturing the liquid ejecting head.SOLUTION: The liquid ejecting head includes: a holding member having a first holding member 500 holding a head body 1 and a second holding member 710; and the circuit substrate 600 held in a circuit substrate holding part 713 which is a space between the first holding member 500 and second holding member 710, and connected with a driving wire of the head body 1. The circuit substrate holding part 713 is sealed by an adhesive 900 in a region except the region wherein a connection wire 610 is connected to the circuit substrate 600. A locking claw 714 set on two or more side faces of one periphery of the holding member is engaged with the other holding member to fix the first holding member 500 and second holding member 710, and the first holding member 500 is fixed to the second holding member 710 with screw members 901.