| 发明名称 |
METHOD FOR PROCESSING SUBSTRATE USING LASER BEAM |
| 摘要 |
A method for processing a substrate includes generating a first laser beam, splitting the first laser beam into a plurality of second laser beams, focusing the split second laser beams on a plane in the substrate parallel to a main surface of the substrate, and performing surface separation of the substrate along the plane. |
| 申请公布号 |
KR20110114972(A) |
申请公布日期 |
2011.10.20 |
| 申请号 |
KR20100034391 |
申请日期 |
2010.04.14 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO, SUNG IL;JIN, HO TAE;KIM, HEUI SEOG;OH, SEON JU |
| 分类号 |
H01L21/301;H01L21/304 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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