| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer resistivity measuring apparatus capable of properly correcting variation of measured values in the vicinity of a wafer edge portion and capable of finding out an accurate value.SOLUTION: In the semiconductor wafer resistivity measuring apparatus for measuring the resistivity of a semiconductor wafer 12 by using a 4-probe resistivity measuring instrument, resistivity values on a plurality of positions on a straight line in a radius direction from an edge portion of the semiconductor wafer 12 are measured by a measuring means by changing a probe of a current to be supplied to four probes of the 4-probe probe 14 and a probe of a voltage to be measured. Each operation for the plurality of values measured by the measuring means is performed, and then each operated value is multiplied by an edge portion correction coefficient based on a difference between a distance from each measuring position up to the wafer edge portion and a distance from each measuring position up to an edge portion of a thin film formed on the semiconductor wafer to obtain a resistance value. |
