发明名称 HOUSING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a housing structure for mating a cover and a chassis with each other via a packing which is miniaturized and reduced in weight and which has high sealing property.SOLUTION: A rib 1a is provided on the inside surface of a cover 1. A projection 2a is provided on the edge of a chassis 2 in opposition to the rib 1a. A groove 2b for housing a packing 3 is provided on the outer periphery surface of the chassis 2. The cover 1 and the chassis 2 are mated with each other by inserting the projection 2a into the rib 1a and covering the groove 2b and the packing 3 with the cover 1 from the outside.
申请公布号 JP2011211007(A) 申请公布日期 2011.10.20
申请号 JP20100078101 申请日期 2010.03.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEMURA TAKASHI;UCHINO HIDEKI
分类号 H05K5/06 主分类号 H05K5/06
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