| 摘要 |
PROBLEM TO BE SOLVED: To provide an imidazole compound which has a long-term latency at room temperature of 40°C or lower, a fast hardening property in a short time at a high temperature of 100°C or higher, a solvent resistance against various organic solvents, and low hygroscopicity hardly producing bubbles in a cured product; a method for producing the imidazole compound; and a hardening epoxy resin composition including the imidazole compound and an epoxy resin.SOLUTION: The imidazole compound is represented by general formula (1), wherein R, R, R, R, Rand Rare each independently a hydrogen atom, a halogen atom, a 1-20C alkoxy group optionally including a substituent, an aromatic group optionally including a substituent, a 1-20C alkyl group optionally including a substituent, or a phenoxy group optionally including a substituent; Qand Qare each independently a 1-20C alkylene group optionally including a substituent; and Z is a 1-20C alkyl group optionally including a substituent, or an aromatic group optionally including a substituent. |
