| 摘要 |
PROBLEM TO BE SOLVED: To integrally perform a current fuse function and a thermal fuse function with a heating resistor, and also achieve miniaturization.SOLUTION: A fuse device includes a ceramic structure 1, a current fuse element pattern 2, and a thermal fuse element 3. The ceramic structure 1 is integrally formed by baking and includes a lower layer 11, an interposed layer 12, and an upper layer 13. The current fuse element pattern 2 is integrally formed with the ceramic structure 1 by baking. The thermal fuse element 3 is arranged on an upper surface of the upper layer 13. |
