发明名称 METHOD OF MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component, which effectively prevents structural defects such as cracking, non-lamination, etc., after being fired, and remedies breakdown voltage defects.SOLUTION: The method of manufacturing the laminated ceramic electronic component includes a process of forming a green sheet containing ceramic particles, a process of forming an electrode pattern using electrode paste including conductive particles, and a process of forming a margin pattern having complementary relationship with the electrode pattern by using margin paste containing margin ceramic particles, wherein the electronic component satisfies 0.9≤r2/r3≤1.1, 0.7≤t2/t1≤0.9, and 1.25≤d1/d2≤1.67, wherein d1 represents a mass of conductive particles per unit volume of the electrode pattern, t1 an electrode pattern thickness, d2 a mass of the margin ceramic particles per unit volume of the margin pattern, r2 a mean particle size of the margin ceramic particles, t2 a margin pattern thickness, and r3 a mean particle size of the ceramic particles.
申请公布号 JP2011211033(A) 申请公布日期 2011.10.20
申请号 JP20100078490 申请日期 2010.03.30
申请人 TDK CORP 发明人 KITANO AKIRA;ITANI TOMOKAZU;SATO TATSUNORI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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