| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device including a step (A) of bonding an external connection terminal to wiring of a film substrate by thermocompression bonding and a step (B) of resin-sealing a periphery of a bonding part of the semiconductor chip and film substrate, wherein the semiconductor device is manufactured inexpensively with good manufacturing efficiency and void formation in a sealing resin is suppressed.SOLUTION: The bonding step (A) is carried out in a state wherein a part of the film substrate 20 which faces the semiconductor chip 10 is sucked from the side opposite to a bonding side of the semiconductor chip 10, and the resin sealing step (B) is carried out in a state wherein temperatures of the semiconductor chip 10 and film substrate 20 fall and the film substrate 20 has no thermal expansion. |
