发明名称 POWER SUPPLY DEVICE FOR MULTILAYER PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a power supply device for a multilayer printed circuit board, capable of supplying a large current with electrical and mechanical reliability, and capable of increasing a packaging density with a simple structure.SOLUTION: The power supply device supplies power to a backboard 11, which includes the multilayer printed circuit board, through power supply cables 14. The power supply device includes: a mounting pad 12 on which at least two through-holes 121 are provided on a surface of the backboard 11 to allow the penetration of fastening members, and a power supply terminal 13 that is composed of a metal block and has mounting holes 131 aligned with the through-holes provided on the mounting pad. The power supply terminal 13 is fixed on the mounting pad 12 with fastening members 15 inserted from the lower surface of the backboard 11. The end of the power supply cable 14 is fixed on the power supply terminal 13 with a fastening member 16 inserted into at least one of the mounting holes 131 of the power supply terminal 13 fixed on the upper surface of the backboard.
申请公布号 JP2011210962(A) 申请公布日期 2011.10.20
申请号 JP20100077332 申请日期 2010.03.30
申请人 YOKOGAWA ELECTRIC CORP 发明人 TAKAHASHI IKUMITSU;NIHEI TAKUYA
分类号 H05K1/18 主分类号 H05K1/18
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