| 摘要 |
PROBLEM TO BE SOLVED: To provide a particle detection method that enables detection sensitivity to be enhanced in a laser scattering system, even if the particles adhered to a workpiece are organic particles.SOLUTION: In the particle detection method for detecting the particles P adhered to the surface of a wafer W by irradiating the surface of the wafer W with light and detecting the scattered light from the surface of the wafer W, film forming treatment is applied to the surface of the wafer W within a predetermined temperature range preventing the damage of the particles P, and the surface of the wafer W subjected to the film forming treatment is irradiated with light, so that the scattered light from the surface of the wafer W is detected to detect the particles P. |
