发明名称 ACTIVE ENERGY RAY CURABLE RESIN COMPOSITION AND FILM SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an active energy ray curable resin composition for coating, wherein hardness is obtained even when applied to a film substrate or the like, and there is low contraction and little warpage (curl) of the film during curing; and to provide a film substrate having a cured layer in which the composition is cured.SOLUTION: The active energy ray curable resin composition is obtained by reacting polyisocyanate having an aliphatic structure with (meth)acrylate containing a hydroxyl group and comprises urethane (meth)acrylate (A) having an ethylenic unsaturated group in a range of 8-10 mmol/g, pentaerythritol tetraacrylate (B) and pentaerythritol triacrylate (C), wherein the total content of (B) and (C) is 10-30 pts.wt. based on 100 pts.wt. of the total of (A), (B) and (C); and the ratio [(B)/(C)] between the contents of the (B) and the (C) is 95/5 to 65/35 in the weight ratio.
申请公布号 JP2011208032(A) 申请公布日期 2011.10.20
申请号 JP20100077589 申请日期 2010.03.30
申请人 DIC CORP 发明人 MORIYA MASAKO;TANIMOTO YOICHI;ISHIDA HIDEYUKI
分类号 C08F220/36;C09D4/02;C09D7/12;C09D175/14 主分类号 C08F220/36
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