发明名称 |
COPPER FOIL FOR PRINTED WIRING BOARD AND LAYERED BODY WHICH HAVE SUPERIOR HEATING DISCOLORATION RESISTANCE AND ETCHING PROPERTY |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board and a layered body which have superior heating discoloration resistance and etching properties.SOLUTION: The copper foil for the printed wiring board includes a copper foil base material and a coating layer which covers at least a part of a surface of the copper foil base material. The coating layer is composed of noble metal particles and a carrying agent which covers the noble metal particles and is composed of a material other than nobel metal and copper. |
申请公布号 |
JP2011210986(A) |
申请公布日期 |
2011.10.20 |
申请号 |
JP20100077822 |
申请日期 |
2010.03.30 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
FURUSAWA HIDEKI;MURATA MASATERU;CHUGANJI MISATO |
分类号 |
H05K1/09;B32B15/04;B32B15/20;C23F1/00;H05K1/03;H05K3/06 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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