发明名称 COPPER FOIL FOR PRINTED WIRING BOARD AND LAYERED BODY WHICH HAVE SUPERIOR HEATING DISCOLORATION RESISTANCE AND ETCHING PROPERTY
摘要 PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board and a layered body which have superior heating discoloration resistance and etching properties.SOLUTION: The copper foil for the printed wiring board includes a copper foil base material and a coating layer which covers at least a part of a surface of the copper foil base material. The coating layer is composed of noble metal particles and a carrying agent which covers the noble metal particles and is composed of a material other than nobel metal and copper.
申请公布号 JP2011210986(A) 申请公布日期 2011.10.20
申请号 JP20100077822 申请日期 2010.03.30
申请人 JX NIPPON MINING & METALS CORP 发明人 FURUSAWA HIDEKI;MURATA MASATERU;CHUGANJI MISATO
分类号 H05K1/09;B32B15/04;B32B15/20;C23F1/00;H05K1/03;H05K3/06 主分类号 H05K1/09
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