发明名称 |
INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING WAVEGUIDE |
摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit package assembly including a waveguide.SOLUTION: Some embodiments of this specification relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed. |
申请公布号 |
JP2011211705(A) |
申请公布日期 |
2011.10.20 |
申请号 |
JP20110059371 |
申请日期 |
2011.03.17 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MAURER LINUS;REISENZAHN ALEXANDER;TREML MARKUS;WICKGRUBER THOMAS |
分类号 |
H04B1/40;H01L23/12;H01P3/12;H01P5/107 |
主分类号 |
H04B1/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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