发明名称 INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING WAVEGUIDE
摘要 PROBLEM TO BE SOLVED: To provide an integrated circuit package assembly including a waveguide.SOLUTION: Some embodiments of this specification relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
申请公布号 JP2011211705(A) 申请公布日期 2011.10.20
申请号 JP20110059371 申请日期 2011.03.17
申请人 INFINEON TECHNOLOGIES AG 发明人 MAURER LINUS;REISENZAHN ALEXANDER;TREML MARKUS;WICKGRUBER THOMAS
分类号 H04B1/40;H01L23/12;H01P3/12;H01P5/107 主分类号 H04B1/40
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