| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board of high reliability wherein peeling of an electrode pad from an insulating layer is suppressed.SOLUTION: The wiring board includes an electrode pad 101, conductive patterns 103, 105 and 107 which are connected to the electrode pad and contain a via plug, insulating layers 102, 104, 106 and 108 in which the electrode pad and the via plug are embedded and which have an opening part 108A exposing a part of a principal surface of the electrode pad. The end part of the principal surface of the electrode pad is covered with the insulating layer, and the insulating layer is arranged on the outermost surface of a mounting component mounting surface side. |
