| 摘要 |
PROBLEM TO BE SOLVED: To provide an expand device that easily takes outs a workpiece having wide intervals of chips, and carries it in an extremely compact state.SOLUTION: This invention relates to the expand device 10, wherein an workpiece W1 is a semiconductor wafer W including a plurality of chips C united through an adhesive sheet S on an inner peripheral side of a ring frame RF, and the expand device 10 includes a support means 12 of supporting the workpiece W1, a contact means 13 capable of abutting on a reverse surface side of the adhesive sheet S, and a driving means 14 of elevating the support means 12. The contact means 13 includes a lower member 65 held on a substrate 11 and an upper member 68 which is provided attachably to and detachably from the lower member 65 and abuts on the adhesive sheet S. After the chip C intervals are widened, the adhesive sheet is fixed to the upper member 68 via a holding means H, and the upper member 68 is separated from the lower member 65 to allow transportation. |
