| 摘要 |
PROBLEM TO BE SOLVED: To provide an expand device that cuts off a wafer and a ring frame apart from each other.SOLUTION: This invention relates to the expand device 10, wherein a workpiece W1 is a semiconductor wafer W including a plurality of chips C united through an adhesive sheet S on an inner peripheral side of the ring frame RF, and the expand device 10 includes a support means 12 of supporting the workpiece W1, a contact means 13 capable of abutting on a reverse surface side of the adhesive sheet S, a driving means 14 of elevating the support means 12, and a cutting means 16 capable of cutting off the adhesive sheet S after the tensile force is applied. The support means 12 is lowered to below an upper end of the contact member 13 to apply tensile force in a radiation direction of the adhesive sheet S to increase chip C intervals and in this state, the cutting means 16 cuts the adhesive sheet S, so that the chips C can be carried. |
