| 摘要 |
An LED bulb assembly device having thermal management features. The device and methods for its manufacture are provided. The device consists of a machined base element that accepts a circuit board, a divider element, a heatsink element, and an LED assembly. The LED assembly includes a plurality of LEDs, but typically nine or eighteen. A reflector element encloses the internal components by positively engaging the base element. External electrical contact pins provide for electrical engagement with a compatible decorative lighting fixture.
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