发明名称 SPUTTERING APPARATUS AND METHOD
摘要 A sputtering apparatus includes a preheating chamber, a deposition chamber, a connection assembly connecting the preheating chamber to the deposition chamber, a first supporting assembly received in the preheating chamber, a second supporting assembly received in the deposition chamber, a number of posts capable of mounting on each of the first and second supporting assemblies, and a transferring robot arranged in the preheating chamber. The connection assembly includes a connection member defining a passage in communication with the preheating chamber and the deposition chamber and a partition plate moveably coupled to the connection member. The partition plate is configured for selectively closing or opening the passage. Each post fixes workpieces thereon. The transferring robot is configured for demounting the post from the two supporting assemblies, transferring the demounted post between the preheating chamber and the deposition chamber, and mounting the transferred post on the two supporting assemblies.
申请公布号 US2011253523(A1) 申请公布日期 2011.10.20
申请号 US20100894118 申请日期 2010.09.29
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 WANG CHUNG-PEI
分类号 C23C14/34;C23C14/50 主分类号 C23C14/34
代理机构 代理人
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