STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT

摘要

A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.