| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate with built-in electronic components having high durability against pressure.SOLUTION: A substrate with built-in electronic components includes a wiring pattern, a metal plate that has two or more openings formed thereon and is disposed so as to face the wiring pattern, electronic components disposed in at least one region among regions enclosed by the openings, a first resin part disposed on a face at least opposing to the wiring pattern between both faces of the metal plate, and a second resin part disposed around the electronic components. The second resin part has a different composition from the first resin part. |
