| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-dissipating structure capable of efficiently releasing heat generated at an imaging device to the outside, further, superior in work efficiency during assembly and capable of avoiding misalignment in the imaging device.SOLUTION: A heat-dissipating structure includes a heat-conducting member 400 which is inserted into a gap between a substrate 300a and an imaging device 310a and releases heat generated at the imaging device 310a through a heat-dissipating member to the outside. The heat-conducting member 400 has flexibility, and extends in a direction of insertion to the gap. The heat-conducting member 400 has a heat-conducting sheet 410, a front end member 401 and an elastic member. When a front end portion in the inserting direction is inserted into the gap, in the heat-conducting sheet 410, the front end portion is disposed while being opposed to a rear surface of the imaging device 310a and a rear end portion in a direction opposite to the inserting direction comes into contact with the heat-dissipating member. The front end member 401 is disposed on a rear surface of the front end portion of the heat-conducting sheet 410 in the inserting direction. When inserted into the gap, the elastic member is disposed between the front end member 401 and the substrate 300a and presses the heat-conducting sheet 410 toward the rear surface of the imaging device 310a. |
