TITANIUM COPPER FOR ELECTRONIC PARTS AND ELECTRONIC PARTS USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a hydrogen-containing titanium copper in which both of strength and electric conductivity are improved.SOLUTION: The titanium copper contains Ti by 1.0 to 5.0 mass% and contains H by 0.5 to 4.0 atomic ratio to Ti, the remaining part being Cu and inevitable impurities, wherein, among deposits made of intermetallic compounds of Ti and Cu, the portion thereof having particle size of 5 μm or more is not present and the portion thereof having particle size of 0.1 μm or more and less than 5 μm has number density less than 1×10piece/mmand the release amount of H when heating the titanium copper at material temperature of 350°C for 24 h under reduced pressure of 1 Pa is 10 ppm or less.