发明名称 |
METHOD FOR FABRICATING BUMP STRUCTURE WITHOUT UBM UNDERCUT |
摘要 |
A method for fabricating bump structure without UBM undercut uses an electroless Cu plating process to selectively form a Cu UBM layer on a Ti UBM layer within an opening of a photoresist layer. After stripping the photoresist layer, there is no need to perform a wet etching process on the Cu UBM layer, and thereby the UBM structure has a non-undercut profile.
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申请公布号 |
US2011254151(A1) |
申请公布日期 |
2011.10.20 |
申请号 |
US20100761863 |
申请日期 |
2010.04.16 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN CHIH-WEI;CHENG MING-DA;LU WEN-HSIUNG;LIU CHUNG-SHI |
分类号 |
H01L23/498;H01L21/3205 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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