| 摘要 |
PROBLEM TO BE SOLVED: To suppress oozing of resin when a die pad is sealed with the resin.SOLUTION: The die pad 2 has a first plane 2a as a plane on a side where a semiconductor chip 7 is mounted, a second plane 2b, and a blade portion 5, and a groove 6 which increases in depth toward the inside of the die pad 2 is formed at a boundary part between the blade portion 5 and second plane 2b of the die pad 2. At this time, an angle α of an end of the second plane 2b of the die pad 2 is acute, and an angle β that a wall plane 6a and a wall plane 6b constituting the groove 6 contain is acute and larger than the angle α. |
