发明名称 |
FLEXIBLE BOARD, AND CIRCUIT MODULE INCLUDING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible board that allows connection between a wiring from an electronic component and a pad electrode to be executed, without fail, while ensuring flexibility applicable to various electronic devices, and to provide a circuit module which includes the board.SOLUTION: The flexible board 2 includes a flexible base material 21; each pad electrode 23 being provided on the surface of the base material 21 so as to vibrate each wire (wiring) 32 from an electronic component 3 and to allow each wire to be connected therewith; each via (first via) 25 embedded in the base material 21 and jointed to each pad electrode 23. The via (first via) 25 is formed of a material having rigidity which is higher than that of the base material 21. |
申请公布号 |
JP2011210930(A) |
申请公布日期 |
2011.10.20 |
申请号 |
JP20100076863 |
申请日期 |
2010.03.30 |
申请人 |
MURATA MFG CO LTD |
发明人 |
KUBOTA KAZUHIKO;KUBOTA KENJI;NAGAMURA MAKOTO;CHISAKA SHUNSUKE;OKUMURA SHO;NAGATA ATSUSHI |
分类号 |
H01L23/12;H05K1/11;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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