| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board having an excellent plating burying property in a through-hole and having a superior long-term connection reliability in an insulating substrate corresponding to the reduction of the diameter, thinning or aspect ratio enhancing of the printed-wiring board, and also to provide the method of manufacturing the insulating substrate and a semiconductor device.SOLUTION: The insulating substrate 21 is used for a printed-wiring board. The insulating substrate 21 includes the through-hole 41 while the through-hole 41 has the minimum diameter at a fixed depth place from one surface side of the insulating substrate 21 to the other surface side of the insulating substrate. In the insulating substrate, the diameter of the through-hole 41 is reduced towards the fixed depth place from one surface sides of the insulating substrate 21, and the diameter of the through-hole 41 is enlarged towards the other surface sides of the insulating substrate 21 from the fixed depth place in this case. |
