发明名称 NONCONTACT IC BUILT-IN PAPER SHEET, AND BOOKLET WITH IC OR IC CARD
摘要 PROBLEM TO BE SOLVED: To provide a noncontact IC built-in paper sheet of high reliability capable of enhancing corrosion resistance in a lead frame that is a connection part of an aluminum antenna and an IC module constituting a noncontact type IC inlet built in the noncontact IC built-in paper sheet used in a booklet with an IC or an IC card.SOLUTION: The noncontact IC built-in paper sheet 10 is built in a printing medium 30 with the noncontact type IC inlet 26 provided with the IC module 25 and the aluminum antenna 21, and includes an intermediate layer 31 for storing the IC inlet, and a surface layer 32 and a reverse face layer 33 formed on obverse and reverse faces of the intermediate layer, and the lead frame 23 that is the connection part of the aluminum antenna and the IC module constituting the noncontact type IC inlet comprises metal of the kind same to that of the aluminum antenna in the noncontact IC built-in paper sheet.
申请公布号 JP2011210015(A) 申请公布日期 2011.10.20
申请号 JP20100077132 申请日期 2010.03.30
申请人 TOPPAN PRINTING CO LTD 发明人 MINOWA KAZUYO
分类号 G06K19/077;B42D11/00;B42D15/10;G06K19/07 主分类号 G06K19/077
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