| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip capable of preventing a short circuit caused by the flocculation of conductive particles contained in a conductive adhesive, and capable of enhancing an adhesive force due to the adhesive, and a noncontact type data transceiver equipped therewith.SOLUTION: This IC chip 10 includes a metal base material 11, a semiconductor layer 12 formed on one face 11a of the metal base material 11, and a terminal 13 provided on a face opposite to the face contacting with the metal base material 11 of the semiconductor layer 12, an outer edge 11c of the metal base material 11 is bent to a side opposite to the face provided with the terminal 13, and the semiconductor layer 12 is a printed layer formed in a portion other than the outer edge 11c of the metal base material 11 by print using ink containing a semiconductor material. |
