发明名称 |
HEAT TRANSPORTING UNIT, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE |
摘要 |
The heat transporting unit according to the Present Disclosure comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region. |
申请公布号 |
WO2011130748(A2) |
申请公布日期 |
2011.10.20 |
申请号 |
WO2011US32919 |
申请日期 |
2011.04.18 |
申请人 |
MOLEX INCORPORATED;TSURUTA, KATSUYA;OHSAWA, KENJI;FUKUNAGA, RINKOU |
发明人 |
TSURUTA, KATSUYA;OHSAWA, KENJI;FUKUNAGA, RINKOU |
分类号 |
H05K7/20;F28D15/02;H01L23/373 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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