发明名称
摘要 A method for optimizing the location of heating elements within a mold for a rubber article is provided. More particularly, a method is also provided for optimizing the position of one or more heating elements, e.g., curing pins or sipes, within the tread of a tire to improve the efficiency of the curing process.
申请公布号 JP2011526848(A) 申请公布日期 2011.10.20
申请号 JP20110516252 申请日期 2008.06.30
申请人 发明人
分类号 B29C33/02;B29C35/02;B29D30/00 主分类号 B29C33/02
代理机构 代理人
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