| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit component mounting system that can perform recovery from a failure to install the electronic circuit component while suppressing the deterioration of production efficiency.SOLUTION: The electronic circuit component mounting system has a control device for controlling the mounting device having a multi nozzle head 40. The mounting device includes (a) a head change control part for changing the control device to perform head by exchanging a multi nozzle head 40 with another nozzle head or with at least another absorption nozzle 154 in the absorption nozzle 154 held by the multi nozzle head 40 while a mounting operation is carried out for one piece of circuit substrate by the multi nozzle head 40, and (b) an intensive recovery control part which is performed prior to a head change, and makes the mounting device perform intensive recovery for intensively carrying out a mounting operation again for an electronic circuit component that fails in mounting among the electronic circuit components to be mounted by the multi nozzle head 40 before a change immediately before a head change by control by the head change control part. |
