| 摘要 |
PROBLEM TO BE SOLVED: To provide an antistatic adhesive tape for semiconductor processing, which causes little contamination on an adherend and little aging of an adhesive property as well as little influence to a surface of the adherend during dicing or back grinding treatment of a semiconductor component, and which can exhibit antistatic properties after ultraviolet curing even if an adhesive layer is thick.SOLUTION: The antistatic adhesive tape for semiconductor processing constituted by a base film and a photocuring adhesive layer includes: an antistatic layer containing a conductive polymer at least on one surface of the base film; and an adhesive layer containing a photocuring unsaturated carbon bond in a molecule of a base polymer on the antistatic layer, wherein a surface resistivity on the adhesive layer side before and after the ultraviolet curing is 1×10to 5×10Ω/square, a thickness of the adhesive layer is 20-250 μm, and a 90-degree peeling adhesive power of the adhesive layer after the ultraviolet curing when the adhesive tape adheres to a silicon mirror wafer is 0.15-0.25 N/25 mm. |
