| 摘要 |
PROBLEM TO BE SOLVED: To obtain efficient cooling performance in a semiconductor module.SOLUTION: A thickness of a portion at a side bonded to a copper block 9a of an upper arm in a heat sink 10b is made larger than that of a heat sink 10a, and a thickness of a heat sink 10c is made larger than that of a portion at a side bonded to a semiconductor chip 8b of a lower arm in the heat sink 10b. Thus, thermal diffusion in heat dissipation from a semiconductor chip 8a and the semiconductor chip 8b and thermal diffusion in heat dissipation from the copper block 9a and a copper block 9b are made nearly the same size within one plane exposed from an encapsulating resin unit 12 of the heat sinks 10a to 10c. Then, the area of the thermal diffusion corresponds to the area of a portion contributing to the heat dissipation, thus optimizing the area of the portion contributing to the heat dissipation by setting the size of the thermal diffusion in each unit to be the same, and hence obtaining efficient cooling performance. |
