APPARATUS AND METHOD OF SUBSTRATE TREATMENT

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method of substrate treatment capable of enhancing the cleanliness of a substrate.SOLUTION: A first treatment chamber 8 and a second treatment chamber 9 partition a first treatment space S1 and a second treatment space S2, respectively. The second treatment space S2 is so formed in the first treatment space S1 as to communicate with the first treatment space S1. A substrate W supported by a spin chuck 10 is disposed in the first treatment space S1 or the second treatment space S2 by a chuck lifting mechanism 36. A treatment liquid feeding mechanism 12 supplies the substrate W with a treatment liquid in the second treatment space S2. Atmospheric pressure in the first treatment space S1 and the second treatment space S2 is controlled by an exhaust mechanism 23 and an FFU 24 so that the atmospheric pressure in the first treatment space S1 is higher than that outside the first treatment space S1 and atmospheric pressure in the second treatment space S2 is lower than that in the first treatment space S1.