| 摘要 |
An EUV mirror module is disclosed that comprises a substrate with a curved upper surface and a curved electroformed mirror. A self-adjusting bonding material is disposed between the substrate and the electroformed mirror. The bonding material is flowable at a melting temperature and self-adjusts to conformally fill the region between substrate to the electroformed mirror and bond the substrate and the electroformed mirror. The substrate may have at least one cooling channel for cooling the mirror module.
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