摘要 |
An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention as a means for achieving the object is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.
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