METHOD FOR FABRICATING THROUGH-SUBSTRATE MICROCHANNELS
摘要
A method of forming large microchannels in an integrated circuit by etching an enclosed trench into the substrate and later thinning the backside to expose the bottom of the trenches and to remove the material enclosed by the trench to form the large microchannels. A method of simultaneously forming large and small microchannels. A method of forming structures on the backside of the substrate around a microchannel to mate with another device.
申请公布号
WO2011130693(A2)
申请公布日期
2011.10.20
申请号
WO2011US32767
申请日期
2011.04.15
申请人
TEXAS INSTRUMENTS INCORPORATED;TEXAS INSTRUMENTS JAPAN LIMITED;JACOBSEN, STUART, M.;BURGESS, BYRON, N.