LED PACKAGE HAVING A THERMOELECTRIC COOLING DEVICE EMBEDDED THEREIN
摘要
<p>Disclosed is an LED package having a thermoelectric cooling device embedded therein. An LED device is mounted on the top surface of a circuit board. The thermoelectric cooling device is installed adjacent to the LED device and parallel to the top surface of the circuit board. A sealant is formed over the LED device and the thermoelectric cooling device.</p>
申请公布号
WO2011129514(A1)
申请公布日期
2011.10.20
申请号
WO2010KR09132
申请日期
2010.12.21
申请人
KOREA INSTITUTE OF MACHINERY & MATERIALS;KIM, JUNG YUP;HYUN, SEUNG MIN;PARK, HYUN-SUNG;JANG, BONG KYUN;HAN, SEUNG-WOO
发明人
KIM, JUNG YUP;HYUN, SEUNG MIN;PARK, HYUN-SUNG;JANG, BONG KYUN;HAN, SEUNG-WOO
