发明名称 Chassis with distributed jet cooling
摘要 A chassis (10) with distributed jet cooling is provided. The chassis includes one or more sidewalls (12) defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins (14) thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly (30) comprising a multi-orifice synthetic jet (30) or a number of single orifice synthetic jets (2) disposed on a side (15, 16) of a respective one of the array(s) of fins. The chassis further includes at least one attachment means (4, 6, 9, 11, 20, 44) for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.
申请公布号 EP2378848(A2) 申请公布日期 2011.10.19
申请号 EP20110162122 申请日期 2011.04.12
申请人 GENERAL ELECTRIC COMPANY 发明人 ARIK, MEHMET;GERSTLER, WILLIAM DWIGHT;LI, RI;NICEWARNER, EARL ROSS;SCHROEDER, CHRISTINA CLYDE;VANDER PLOEG, BENJAMIN JON;WHALEN, BRYAN PATRICK
分类号 H05K7/02;H05K7/20 主分类号 H05K7/02
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