发明名称 |
Chassis with distributed jet cooling |
摘要 |
A chassis (10) with distributed jet cooling is provided. The chassis includes one or more sidewalls (12) defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins (14) thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly (30) comprising a multi-orifice synthetic jet (30) or a number of single orifice synthetic jets (2) disposed on a side (15, 16) of a respective one of the array(s) of fins. The chassis further includes at least one attachment means (4, 6, 9, 11, 20, 44) for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls. |
申请公布号 |
EP2378848(A2) |
申请公布日期 |
2011.10.19 |
申请号 |
EP20110162122 |
申请日期 |
2011.04.12 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
ARIK, MEHMET;GERSTLER, WILLIAM DWIGHT;LI, RI;NICEWARNER, EARL ROSS;SCHROEDER, CHRISTINA CLYDE;VANDER PLOEG, BENJAMIN JON;WHALEN, BRYAN PATRICK |
分类号 |
H05K7/02;H05K7/20 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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