发明名称 |
COMPOSITION FOR FORMING HIGH-DIELECTRIC FILM FOR FILM CAPACITOR |
摘要 |
<p>The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20°C, 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20°C, 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.</p> |
申请公布号 |
EP2378529(A1) |
申请公布日期 |
2011.10.19 |
申请号 |
EP20090834827 |
申请日期 |
2009.12.21 |
申请人 |
DAIKIN INDUSTRIES, LTD. |
发明人 |
YOKOTANI, KOUJI;OTA, MIHARU;TATEMICHI, MAYUKO;KOMATSU, NOBUYUKI;MUKAI, ERI;KOH, MEITEN |
分类号 |
H01G4/20;C08J5/18;C08K9/04;C08L27/12;C08L101/00;H01B3/00;H01B17/56;H01G4/18 |
主分类号 |
H01G4/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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