| 摘要 |
PROBLEM TO BE SOLVED: To provide plating equipment and a plating method which provide a plating film with high-quality and uniform film thickness, and to provide a method for manufacturing a chip type electronic component.SOLUTION: The plating equipment 20 has: a generating means 26 to generate a flow of a plating solution 30 inside a plating tank 21; a guiding means 28 to regulate a flow direction of the plating solution 30; an anode electrode 29 arranged midway along the flow of the plating solution 30; and retaining means 31, 32 arranged midway along the flow of the plating solution 30 and making an object 10 to be plated flowing with the plating solution 30 temporarily retained therewith, wherein at least a part of the retaining means 31, 32 is constituted of cathode electrodes 31d, 32d. |
