发明名称 |
RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE |
摘要 |
<p>A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.</p> |
申请公布号 |
EP2166036(A4) |
申请公布日期 |
2011.10.19 |
申请号 |
EP20080765484 |
申请日期 |
2008.06.11 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
TAKAHASHI, TOYOSEI;TAKAYAMA, RIE;DEJIMA, HIROHISA;KUSUNOKI, JUNYA |
分类号 |
C08L61/14;C08F2/44;C08G8/30;C08L63/00;H01L21/768;H01L23/14;H01L23/48;H01L23/52 |
主分类号 |
C08L61/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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