| 摘要 |
<p>Provided are a light emitting device (100) and a light emitting device package having the same. The light emitting device includes a first light emitting structure layer (210) including a plurality of semiconductor layers, a first electrode on the first light emitting structure layer, a first insulation layer (108) under the first light emitting structure layer, a second light emitting structure layer (220) including a plurality of semiconductor layers under a first reflective layer (117) , a second reflective layer (135) under the second light emitting structure layer, a bonding layer (119,145) between the second light emitting structure layer and the first reflective layer, and a plurality of connection members (115,116,139,142,138) connecting the first light emitting structure layer to the second light emitting structure layer in parallel.</p> |
