| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic board, which has excellent heat radiating property and high film coating property and on which a thin film printed circuit layer is surely formed, a thin film printed circuit board, which has high film coating property and on which the thin film printed circuit layer is formed, and a method of manufacturing the ceramic board prevented from the generation of warpage after polishing. SOLUTION: The ceramic board is composed of a plate like ceramic sintered compact 2 and the warpage of the board is controlled to <=5 μm/inch. |
