LASER PROCESSING OF WORKPIECES CONTAINING LOW-K DIELECTRIC MATERIAL

摘要

Laser output including at least one laser pulse having a wavelength greater than 1.1μm and shorter than 5μm (preferably at about 1.1μm) and having a pulsewidth shorter than 100 ps (preferably shorter than 10 ps) permits low-k dielectric material, such as SRO or SiCOH, to be removed without damaging the substrate. An oscillator module in cooperation with an amplification module are used to generate the laser output.