发明名称 |
Composition for cutting off heat-ray, film formed therefrom, and method for forming the composition and the film |
摘要 |
Disclosed are heat-ray cutoff compounds, films and method using them. The heat-ray compound is produced by dispersing conductive nanoparticles in an amphoteric solvent with acids and dispersion sol, which provides a low cost production for the heat-ray cutoff films because it is able to any resin binder without sorting the kinds of resin binders (hydrolic or alcoholic, or anti-hydrolic).
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申请公布号 |
US8038786(B2) |
申请公布日期 |
2011.10.18 |
申请号 |
US20050521025 |
申请日期 |
2005.07.26 |
申请人 |
HAE-WOOK LEE |
发明人 |
LEE HAE-WOOK;PARK JIN-HONG |
分类号 |
C04B14/00;B05D3/02;B05D3/06;B32B5/16;C01G19/00;C01G19/02;C01G25/00;C08J3/205;C08K3/00;C09C1/00;C09D5/00;C09D5/24;H01B1/08;H01B1/14 |
主分类号 |
C04B14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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